COF PUNCH/SINGULATION PROCESS
REEL COF PUNCH MAX: 60mm*60mm
REEL COF PUNCH MIN: 20mm*10mm
PUNCH UNIT CYCLE TIME: 3 SECONDS
MASS PRODUCTION YIELD: 99%
COF IC FOR LCD TV MODULE
PI THICKNESS 38μm
CU THICKNESS 8μm
MIN PITCH: 40 μm
FOR LG OR SAMSUNG
COF IC FOR LCD PC MODULE
PI THICKNESS 38μm
CU THICKNESS 8μm
MIN PITCH: 35 μm
FOR LG OR SAMSUNG
COF IC FOR LCD TV MODULE
PI THICKNESS 38μm
CU THICKNESS 8μm
MIN PITCH: 40 μm
FOR LG OR SAMSUNG
COF FLIP-CHIP BONDING
PI THICKNESS 38μm
CU THICKNESS 8μm
MIN PITCH: 25μm
PLATING: SN PLATING
COF PACKAGE MODULE
COF INTEGRATED MODULE
(COF-SMD)+(COF CHIP BONDING)
COF-FOG BONDING
COF IC FOR LCD PC MODULE
PI THICKNESS 38μm
CU THICKNESS 8μm
MIN PITCH: 35 μm
FOR LG OR SAMSUNG
COF FILM FOR OLED
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 40μm
PLATING: NI/AU PLATING
COF FILM-SMD+COF ILB
COF HALF INTEGRATED MODULE
(COF-SMD)+(COF CHIP BONDING)
COF FILM-SMD+COF ILB
COF HALF INTEGRATED MODULE
(COF-SMD)+(COF-CHIP BONDING)
Homray Micron Technology. All rights Reserved.
E-mail: jerry@homray-tech.com ; serena@homray-tech.com
M.P: +86-15366208370 ;